Your browser does not support javascript! Please enable it, otherwise web will not work for you.

Princ Eng Design Enablement / IC Package @ Globalfoundries

Home > Engineering Design

 Princ Eng Design Enablement / IC Package

Job Description

Essential Responsibilities Include:

  • Ensure the IC design/process can be manufactured with the given package for mechanical and electrical integrity.

  • Account for the packaging physical and electrical properties to include with the silicon for co - simulation of the two to ensure circuit targets are maintained. This includes design of passive matching circuitry as part of the package such as inductors or transformers when applicable (RDL). As such, having a background in RF/mmWave circuit functions is required: Low Noise Amplifiers, Power Amplifiers.

  • Design PCB test boards to interface with the packaging

  • Experience in Patch antenna design is a plus

  • The responsibility includes complete understanding of circuit topologies, best class architecture development, Design from Specifications, Sub - Block circuit design, layout or guidance to layout effort and review etc.

    • You will work directly with existing team working on
    circuit architecture development from spec, IP - Level/Block - Level Circuit Design, Simulations, Results Documentation for review, PDK assessment with IP, Layout Design and Layout verification.
    The assignment would involve getting exposure to leading edge foundry EDA tools, design flows, and yield / design interaction.

    Required Qualifications:

  • MSEE or PhD from an accredited program on Electronics Engineering, Microelectronics with focus on the mentioned circuits.

  • MS/MTech (4 - 5) years or PhD (0 - 3) years

  • Minimum of 3 months experience with UNIX environment.

  • Excellent academic standing.

  • Attention to detail and Learning skills

  • Self - motivated; able to take ownership of assignments, develop work plans and proactively seek feedback to ensure objectives are aligned and met.

  • Strong written and oral communications skills.

  • Team player; able to succeed in a dynamic, fast paced environment.

    • Preferred Qualifications:

  • PhD/M.Tech Student from reputed academic Institutes in India (Ex: IITs or NITs or BITs))

  • Experience with any domain listed above in Part B.

  • Familiarity with Cadence based packaging and Cadence,PADS PCB design system tools.

    • Job Classification

    Industry: IT-Software, Software Services
    Functional Area: Engineering Design, R&D,
    Role Category: Engineering Design
    Role: Engineering Design
    Employement Type: Full time

    Education

    Under Graduation: Any Graduate in Any Specialization
    Post Graduation: Post Graduation Not Required
    Doctorate: Any Doctorate in Any Specialization

    Contact Details:

    Company: Globalfoundries
    Location(s): Bengaluru

    + View Contact

    Keyskills:   Unix Simulation RF Development Manager EDA tools Circuit designing Packaging Silicon PCB designing Electronics engineering

     Job seems aged, it may have been expired!
     Fraud Alert to job seekers!

    ₹ Not Disclosed

    Globalfoundries

    GLOBALFOUNDRIES, the world's first full-service semiconductor foundry with a truly global manufacturing and technology footprint, is executing its Vision to reshape the semiconductor industry through collaboration and innovation. Launched in March 2009, the company has quickly achieved scale ...

    IndigoJobs © 2024

    For enquiries: contact(at)indigojobs.in

    We are in open beta version of website, please let us know if any issues, at: info(at)indigojobs.in