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Senior ASIC Physical Design Engineer @ Intel

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 Senior ASIC Physical Design Engineer

Job Description

  • IPG APAC is seeking an ASIC Timing Signoff Design Engineer to join our talented and vibrant team.
  • You will be directly involved in delivering next-generation LPDDR5 / DDR5 PHY or Die2Die Interconnects PHY designs for SOC application on leading process nodes.

Key Responsibilities for this position includes but not limited to:

  • Technical know-how of RTL to GDSII phase of the ASIC design flow with expert-level understanding and hands-on experience of constraints development, timing analysis and signoff closure
  • Expert-level understanding and generation of Constraint/exceptions, clock definitions, IP timing analysis and signoff, IP lib modeling, timing signoff methodology and multi
  • PVT timing convergence and signoff.
  • Knowledge of advanced signoff analysis concepts such as multi-power domain analysis, POCV, spatial analysis is good to have.
  • Having hands-on experience of Synthesis, formal equivalence, CTS, place and route, physical layout verification is a plus.


  • You should possess a relevant educational qualification, BSEE or equivalent with 7 years/MSEE or equivalent with 5 years design experience in the timing/physical design domain.

Additional qualifications include:Have multiple tap

Job Classification

Industry: Electronic Components / Semiconductors
Functional Area: Engineering - Software,
Role Category: Software Development
Role: Software Development
Employement Type: Full time

Education

Under Graduation: Any Graduate
Post Graduation: Any Postgraduate
Doctorate: Any Doctorate

Contact Details:

Company: Intel
Location(s): Bengaluru

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Keyskills:   VLSI static timing analysis Architecture EDA tools SOC Perl ASIC Design Internship Python Physical design

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Intel

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