Silicon Packaging Design Lead Engineer
- Intel
- 8 - 10 Years
- Bengaluru
- 4 years ago
- Email to a friend
- Report this job
Job Description
Job Description :
Job Description
The engineer is responsible for leading the footprint and pinmap/ballmap definition from the planning phase/early pathfinding to the package tape out of high-density package for Intel Microprocessors and Chipsets. It is expected that the lead has a strong understanding of PCB and package technology aspects, covering electrical, power, thermal, mechanical disciplines. The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos. Must have experience in delivering high-speed PCBs or high density flip chip interconnect based package designs, using Mentor Xpedition or Allegro Tool for physical design. The responsibilities include:- Support the development of pinmap/ballmap, in collaboration with the Senior Package Design, System Hardware, Power Integrity, and Signal Integrity engineers. - Owning the route and fit studies, during the early phase of package definition. - Planning and executing the package substrate design activities, meeting the schedule and quality expectations, throughout the development process cycle. - Driving design reviews with stakeholders
Qualifications
Qualifications: Should possess a Bachelor of Engineering in the field of Electronics and Communication.. Candidates with strong PCB physical design with good knowledge of Mentor tool will be considered. Experience/Competencies: 8-10 years of experience in designing PCBs or Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in leading package design Exposure to Package/Board physical design tool - Mentor Expedition and/or Allegro is needed Perform package design work such as package fit assessment, package stack-up study, design rule to HVM, package signal and integrity requirement. Optimize package layout include pinmap/ballmap, stack-up and design methodology. The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos Implement PCB design solution to product feature set requirement, and drive project development to schedule Knowledge of signal integrity and power integrity basics are must Prior experience in using electrical design analysis tools such as Ansoft, HSpice, Sigrity will be added advantage Must be highly motivated, self-directed, and should be able to work effectively, both independently and with other team membersInside this Business Group
The Client Computing Group (CCG) is responsible for driving business strategy and product development for Intel's PC products and platforms, spanning form factors such as notebooks, desktops, 2 in 1s, all in ones. Working with our partners across the industry, we intend to continue to advance PC experiences to deliver the real-world performance people demand. As the largest business unit at Intel, CCG is investing more heavily in the PC, ramping its capabilities even more aggressively, and designing the PC experience even more deliberately, including delivering a predictable cadence of leadership products. As a result, we are able to fuel innovation across Intel, providing an important source of IP and scale, as well as help the company deliver on its purpose of enriching the lives of every person on earth.
Legal Disclaimer:
Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
It has come to our notice that some people have received fake job interview letters ostensibly issued by Intel, inviting them to attend interviews in Intel's offices for various positions and further requiring them to deposit money to be eligible for the interviews. We wish to bring to your notice that these letters are not issued by Intel or any of its authorized representatives. Hiring at Intel is based purely on merit and Intel does not ask or require candidates to deposit any money. We would urge people interested in working for Intel, to apply directly at and not fall prey to unscrupulous elements.
Employement Category:
Employement Type: Full timeIndustry: SemiconductorFunctional Area: ITRole Category: Software EngineerRole/Responsibilies: Silicon Packaging Design Lead EngineerContact Details:
Company: IntelLocation(s): Bengaluru+ View Contact
Fraud Alert to job seekers!
₹ Not Specified
Intel
Our Client is a mid level web and mobile application development company located at Kovilambakkam.
Job Listings
We are in open beta version of website, please let us know if any issues, at: info(at)indigojobs.in