Silicon Packaging Design Lead Engineer
- Intel Technology India
- 2 - 8 years
- Bengaluru
- 3 years ago
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Job Description
The engineer is responsible for leading the design from the planning phase/early pathfinding to the package tape out of high-density package substrates for Intel Microprocessors and Chipsets.
It is expected that the lead has a strong understanding of PCB and package technology aspects, covering electrical, power, thermal, mechanical disciplines.
The role requires the engineer to collaborate and work with highly multi-disciplined teams spread across different geos.
Must have experience in delivering high-speed PCBs or high density flip chip interconnect based package designs, using Mentor Xpedition or Allegro Tool for physical design.The responsibilities include:- Support the development of pinmap/ballmap, in collaboration with the Senior Package Design, System Hardware, Power Integrity, and Signal Integrity engineers.
- Owning the route and fit studies, during the early phase of package definition.
- Planning and executing the package substrate design activities, meeting the schedule and quality expectations, throughout the development process cycle.
- Driving design reviews with stakeholders
Qualifications
:Should possess a Bachelor of Engineering or a Master degree of Science/Engineering in the field of Electronics and Communication..
Candidates with strong PCB physical design with good knowledge of Mentor tool will be considered.Experience / Competencies:- 6-8 years of experience in designing PCBs or Packages for high speed products like CPUs/ASICs/Chipsets at least, 2-3 years in leading package design-Exposure to different Package technologies, an advantage- Exposure to Package/Board physical design tool - Mentor Expedition and/or Allegro is needed- Prior experience in using electrical design analysis tools such as Ansoft, HSpice, Sigrity will be added advantage- Must be data-driven and process-oriented and Strong stakeholder management skills- Motivated, self-directed, and able to work effectively, both independently and within a team
Job Classification
Industry: IT Services & ConsultingFunctional Area: IT Software - Embedded, EDA, VLSI, ASIC, Chip Design,
Role Category: Programming & Design
Role: Programming & Design
Employement Type: Full time
Education
Under Graduation: B.Tech/B.E. in Production/IndustrialPost Graduation: Any Postgraduate in Any Specialization
Doctorate: Doctorate Not Required
Contact Details:
Company: Intel Technology IndiaLocation(s): Bengaluru
Keyskills: Electrical design Microprocessors thermal Silicon packaging design Stakeholder management Design analysis Signal integrity Design Lead Physical design
Intel Technology India
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